It is heterocyclic adhesive which cures fast when heated. it is temperature resistant and easy to operate. No bubbles appear after curing thus making the surface smooth and bright. Its viscosity and heat resistant property is adjustable. It applies to the coating, infiltrating and encapsulating of device surface, electronic components and chips in electric engine, capacitor, thermocouples, transformers, rectifiers, electronic modules LSI and other products to protect them against moisture, chemicals, excessive heat, vibration, mechanical impact and thermal shocks. It also applies to the bonding of metals, alloy, ceramics, glass and transparent compound which work under water or in some humid environment.